主题：LED市场冷清，这里也跟着冷清了。

Cree’s next generation chip which is of a diamond-like surface with SiC substrate. The chip size could likely be 2525 and 3535mm which will likely to be packaged as XLamp “XB-D” and “XT-E”, respectively.

According to our check, XB-D might be used to replace the existing XP-G, and XT-E may be positioned between XP-G and XM-L.

The sample price for XB-D may be around $0.7 and XT-E may be around $1.4-1.5.

Cree 新一代芯片， 2525，或者 3535 的尺寸， （这里原文用 mm, 肯定是错的）

该封装是类似钻石表面的。